Description: 2.5mm Pitch Disconnectable Crimp Style (Wire to Board)
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Header wafer is made of solder crack preventive material, glass-filled PA66 nylon.

Double-row construction.

Secure locking device prevents accidental disconnection.





  • Locking device

The housing has a locking device which securely mates with the header, preventing accidental disconnection resulting from external forces such as the routing of wires during assembly process or vibration.

  • Solder crack preventive material

Header wafer is made of glass-filled PA66 nylon thus effective against solder cracking.

  •  Polarizing boss

Headers with polarizing bosses are also available.

  • Mis-insertion preventive design

Housing ribs prevent mis-insertion of the housing into the header.

  • Standards

UL Recognized E60389

CSA Certified LR20812

TUV Certified R9851219

  • RoHS Compliant